According to Gartner, an international research and consulting firm, global semiconductor capital equipment spending is expected to reach US$44.8 billion in 2011, a 10.2% increase from the US$40.6 billion in 2010. However, analysts also warned against market conditions that the upcoming semiconductor inventory revisions and oversupply in the foundry industry will result in a slight decline in semiconductor capital equipment spending in 2012.
All the blocks in the semiconductor device market are expected to grow in 2011 (see Table 1). Gartner analysts pointed out that the sources of growth in 2011 are mainly the active spending of foundry, the consolidation of IDM logical capacity to advanced processes, and the great memory manufacturers actively investing in secondary designs. Double pattern. With the continuous growth of the semiconductor industry, global fab equipment (WFE) revenue is expected to increase by 11.7% in 2011. Intel, foundry, and NAND spending will drive the demand for advanced equipment, and immersion lithography, etching, and some of the depositions related to secondary patterns and key advanced logic processing will all benefit. Semiconductor capital equipment spending will fall by 2.6% in 2012, and it is expected to grow by 8.9% in 2013. The next cycle of recession should occur in the second half of 2013 due to excess supply of memory.
2011 global packaging (PAE) revenue is expected to grow only 3.6%. Back-end manufacturers realized that they had achieved significant growth in 2010, but market growth has slowed since the fourth quarter of last year. Order demand gradually weakens as supply slows as demand decreases. For the capex of back-end processing suppliers, the current top priority is to find a low-cost solution for 3D packaging and copper wire bonding. Most of the major tool and die markets are expected to grow in 2011, but the performance of advanced tool and die will be better than the overall market level.
The growth rate of the global automatic test equipment (ATE) market in 2011 is expected to reach 6.9%. Gartner's expectation for this growth is mainly due to the continuing demand for system-on-chip (Soc) and advanced RF market segments. Memory automated testing equipment may slow down with DRAM capital expenditure, and it showed a downward trend in 2011. However, NAND's test platform will maintain strong growth this year.
All the blocks in the semiconductor device market are expected to grow in 2011 (see Table 1). Gartner analysts pointed out that the sources of growth in 2011 are mainly the active spending of foundry, the consolidation of IDM logical capacity to advanced processes, and the great memory manufacturers actively investing in secondary designs. Double pattern. With the continuous growth of the semiconductor industry, global fab equipment (WFE) revenue is expected to increase by 11.7% in 2011. Intel, foundry, and NAND spending will drive the demand for advanced equipment, and immersion lithography, etching, and some of the depositions related to secondary patterns and key advanced logic processing will all benefit. Semiconductor capital equipment spending will fall by 2.6% in 2012, and it is expected to grow by 8.9% in 2013. The next cycle of recession should occur in the second half of 2013 due to excess supply of memory.
2011 global packaging (PAE) revenue is expected to grow only 3.6%. Back-end manufacturers realized that they had achieved significant growth in 2010, but market growth has slowed since the fourth quarter of last year. Order demand gradually weakens as supply slows as demand decreases. For the capex of back-end processing suppliers, the current top priority is to find a low-cost solution for 3D packaging and copper wire bonding. Most of the major tool and die markets are expected to grow in 2011, but the performance of advanced tool and die will be better than the overall market level.
The growth rate of the global automatic test equipment (ATE) market in 2011 is expected to reach 6.9%. Gartner's expectation for this growth is mainly due to the continuing demand for system-on-chip (Soc) and advanced RF market segments. Memory automated testing equipment may slow down with DRAM capital expenditure, and it showed a downward trend in 2011. However, NAND's test platform will maintain strong growth this year.
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