"Enterprises must rely on their core competitiveness in order to survive in competition. The core competitiveness comes from independent innovation. Only by changing the product structure, improving the technical level, and innovating, can enterprises be neutral in the fierce market competition. Invincible." Shi Mingda, Chairman of Nantong Fujitsu Microelectronics Co., Ltd., talked about innovation in an interview with the reporter of China Electronics News. "Innovation has been deeply melted in my blood. China's hope lies in the awakening of the entrepreneurial consciousness of a generation of entrepreneurs." This is a point that Wang Xinchao, chairman of Changjiang Electronics Technology, has repeatedly emphasized.
It is precisely because of the influence and promotion of the leading consciousness of this enterprise leader that although the packaging industry has been greatly affected by the financial turmoil, enterprises have successfully weathered the crisis.
The financial crisis has a greater impact on the packaging industry
At present, more than 70% of the sales of the domestic integrated circuit industry comes from exports. The quality of the export situation directly determines the trend of industrial operation. Since 2008, the rapid spread of the international financial crisis has had a great impact on the export of domestic integrated circuits. The packaging industry, which accounts for half of the domestic integrated circuits, was the first to bear the brunt of the crisis. Shi Mingda, chairman of Nantong Fujitsu Microelectronics Co., Ltd., said in an interview with China Electronics News that in the second half of 2008, when the international financial crisis hit, it did cause certain difficulties for Chinese IC packaging and testing companies. In the face of the sudden crisis, the company felt that it was caught off guard, and the production and operation were affected, which caused a big impact. Once the production capacity was short-sold and the work was insufficient. Yu Kangkang, vice chairman of Jiangsu Changjiang Electronics Technology Co., Ltd. and deputy secretary general of China Semiconductor Industry Association, said that since 2009, the company has faced severe challenges in its operation. "The outbreak of the financial crisis has caused the market to shrink sharply and the production capacity is seriously oversupplied. In the first, second and third months of 2009, the capacity utilization rates were 30%, 45% and 70% respectively. At the same time, the prices of products continued to decline and the competition became more intense. The price of devices and integrated circuits decreased by 11.48% and 9.3% respectively from the beginning of the year." Yu Kangkang introduced.
In the face of difficulties, domestic packaging companies are calmly fighting. Shi Mingda said that Nantong Fujitsu has always regarded "grabbing the market" as the top priority of all work, with innovative business thinking and flexible business strategies to ensure that market share is not lost and there is growth. "We timely adjusted the product structure and developed marketable products to ensure that the existing production capacity was fully utilized. When the company was in trouble, we did not stop the pace of technological innovation and investment, and actively promote technological innovation projects." Shi Mingda said. It is precisely because Nantong Fujitsu attaches great importance to the crisis situation, and has taken a series of response measures proactively. With rapid action and proper measures, production and management have been rapidly restored. By March 2009, there was a clear improvement and a quick recovery. Production began to rise sharply in April, and the output for the next few months reached a record high. It is worth mentioning that in the most difficult time, the company always has the same fate with the employees, not only has no layoffs, but also allows the backbone team to be retained, which also provides an important guarantee for the rapid recovery of production. "Today, we look back and see that the international financial crisis broke out. I personally think that it is not as severe as I imagined. From the perspective of our company, the reality is much better than originally expected. Enterprises have basically got rid of the financial crisis. The impact has not only made great progress in technology development, but also seized the rare opportunity brought about by the financial crisis, which further improved the technical level and production scale of the enterprise." Shi Mingda believes.
Innovation enables companies to survive the crisis
To survive in competition, enterprises must rely on core competitiveness. The core competitiveness comes from the independent innovation of technology, products, services, management and systems. Through innovation, it can promote the improvement of organizational forms and the improvement of management efficiency, so that enterprises can adapt to the requirements of economic development. Only by changing the product structure, improving the technical level, and innovating, can an enterprise be in an invincible position in the fierce market competition. "We have long realized that in today's increasingly fierce market competition, if we do not engage in technological innovation, enterprises will not have lasting vitality. If we do not firmly follow the path of low-cost advanced packaging, enterprises cannot jump out of the low-end market. Mud pool, gaining more room for development. We have expanded our reach to the forefront of the world's packaging technology, and established JC-tech Co., Ltd. in Tokyo, Japan, dedicated to the development of advanced packaging products and technologies. At the same time, we firmly grasped Opportunities for the implementation of major national science and technology projects are constantly making new progress in the development of advanced packaging technologies," Shi Mingda said.
According to reports, Nantong Fujitsu took the lead in research and development successfully using the world's leading technology, new materials, new technology, has a lower cost advantage, has a completely independent 12-inch new-WLP wafer-level CSP advanced packaging products, is the world's first. In 2008, the BGA series products developed by Nantong Fujitsu have successfully developed various shapes such as LFBGA and TFBGA. Many varieties such as BGA36, BGA100, BGA180 and BGA360 have been successfully mass-produced. In addition, more than ten types of LGA products of the SiP series and 8, 16, 20, 24, 28, 32, 40, 64 of the QFN and DFN series have been mass-produced. Nantong Fujitsu's self-developed MEMS micro-electromechanical system packaging technology and products, was named 2008 China's semiconductor innovation products and technologies. They are also continuously developing new varieties of packaging density and new shapes based on the original series of product packaging technologies. "Our good performance in advanced packaging products and technology research and development fully demonstrates that we always adhere to the road of independent innovation, and the decision to keep pace with technological innovation is correct." Shi Mingda said.
Accelerating scientific and technological innovation, and concentrating on cultivating and enhancing the competitive advantage of core business is also the choice of Changjiang Electronics Technology. Yu Kangkang believes that in order to seek higher development, it is necessary to accelerate technological innovation and foster and enhance the competitive advantage of core businesses. According to Yu Kangkang, Changdian Technology will transfer its investment focus to high-tech products with independent intellectual property rights, and shift its development focus to the development and application of packaging technologies such as system integration packages (Sip, TSV) in the world's leading edge. Innovative ability, as the central link to transform the economic growth mode, strives to promote the industrialization of scientific and technological achievements, and launch new products that are competitive and welcomed by the market, such as USB, SD, LGA, etc., to form new economic growth points as soon as possible. In addition, changing the business model, from scale expansion and investment-driven to research and development, brand management is also an important measure for Changdian to successfully respond to the crisis. "Change a single specialized OEM model, use new technology to extend the industrial chain to the development of terminal electronic consumer products, brand sales have begun to take shape, and further expand the sales of self-owned brand digital products. At present, the sales area has covered Jiangsu, Zhejiang and Shanghai. In Sichuan and other places, there are more than 40 3C stores, which have gradually formed new growth points, which is of great significance for improving profitability." Yu Kangkang believes.
It is precisely because of the influence and promotion of the leading consciousness of this enterprise leader that although the packaging industry has been greatly affected by the financial turmoil, enterprises have successfully weathered the crisis.
The financial crisis has a greater impact on the packaging industry
At present, more than 70% of the sales of the domestic integrated circuit industry comes from exports. The quality of the export situation directly determines the trend of industrial operation. Since 2008, the rapid spread of the international financial crisis has had a great impact on the export of domestic integrated circuits. The packaging industry, which accounts for half of the domestic integrated circuits, was the first to bear the brunt of the crisis. Shi Mingda, chairman of Nantong Fujitsu Microelectronics Co., Ltd., said in an interview with China Electronics News that in the second half of 2008, when the international financial crisis hit, it did cause certain difficulties for Chinese IC packaging and testing companies. In the face of the sudden crisis, the company felt that it was caught off guard, and the production and operation were affected, which caused a big impact. Once the production capacity was short-sold and the work was insufficient. Yu Kangkang, vice chairman of Jiangsu Changjiang Electronics Technology Co., Ltd. and deputy secretary general of China Semiconductor Industry Association, said that since 2009, the company has faced severe challenges in its operation. "The outbreak of the financial crisis has caused the market to shrink sharply and the production capacity is seriously oversupplied. In the first, second and third months of 2009, the capacity utilization rates were 30%, 45% and 70% respectively. At the same time, the prices of products continued to decline and the competition became more intense. The price of devices and integrated circuits decreased by 11.48% and 9.3% respectively from the beginning of the year." Yu Kangkang introduced.
In the face of difficulties, domestic packaging companies are calmly fighting. Shi Mingda said that Nantong Fujitsu has always regarded "grabbing the market" as the top priority of all work, with innovative business thinking and flexible business strategies to ensure that market share is not lost and there is growth. "We timely adjusted the product structure and developed marketable products to ensure that the existing production capacity was fully utilized. When the company was in trouble, we did not stop the pace of technological innovation and investment, and actively promote technological innovation projects." Shi Mingda said. It is precisely because Nantong Fujitsu attaches great importance to the crisis situation, and has taken a series of response measures proactively. With rapid action and proper measures, production and management have been rapidly restored. By March 2009, there was a clear improvement and a quick recovery. Production began to rise sharply in April, and the output for the next few months reached a record high. It is worth mentioning that in the most difficult time, the company always has the same fate with the employees, not only has no layoffs, but also allows the backbone team to be retained, which also provides an important guarantee for the rapid recovery of production. "Today, we look back and see that the international financial crisis broke out. I personally think that it is not as severe as I imagined. From the perspective of our company, the reality is much better than originally expected. Enterprises have basically got rid of the financial crisis. The impact has not only made great progress in technology development, but also seized the rare opportunity brought about by the financial crisis, which further improved the technical level and production scale of the enterprise." Shi Mingda believes.
Innovation enables companies to survive the crisis
To survive in competition, enterprises must rely on core competitiveness. The core competitiveness comes from the independent innovation of technology, products, services, management and systems. Through innovation, it can promote the improvement of organizational forms and the improvement of management efficiency, so that enterprises can adapt to the requirements of economic development. Only by changing the product structure, improving the technical level, and innovating, can an enterprise be in an invincible position in the fierce market competition. "We have long realized that in today's increasingly fierce market competition, if we do not engage in technological innovation, enterprises will not have lasting vitality. If we do not firmly follow the path of low-cost advanced packaging, enterprises cannot jump out of the low-end market. Mud pool, gaining more room for development. We have expanded our reach to the forefront of the world's packaging technology, and established JC-tech Co., Ltd. in Tokyo, Japan, dedicated to the development of advanced packaging products and technologies. At the same time, we firmly grasped Opportunities for the implementation of major national science and technology projects are constantly making new progress in the development of advanced packaging technologies," Shi Mingda said.
According to reports, Nantong Fujitsu took the lead in research and development successfully using the world's leading technology, new materials, new technology, has a lower cost advantage, has a completely independent 12-inch new-WLP wafer-level CSP advanced packaging products, is the world's first. In 2008, the BGA series products developed by Nantong Fujitsu have successfully developed various shapes such as LFBGA and TFBGA. Many varieties such as BGA36, BGA100, BGA180 and BGA360 have been successfully mass-produced. In addition, more than ten types of LGA products of the SiP series and 8, 16, 20, 24, 28, 32, 40, 64 of the QFN and DFN series have been mass-produced. Nantong Fujitsu's self-developed MEMS micro-electromechanical system packaging technology and products, was named 2008 China's semiconductor innovation products and technologies. They are also continuously developing new varieties of packaging density and new shapes based on the original series of product packaging technologies. "Our good performance in advanced packaging products and technology research and development fully demonstrates that we always adhere to the road of independent innovation, and the decision to keep pace with technological innovation is correct." Shi Mingda said.
Accelerating scientific and technological innovation, and concentrating on cultivating and enhancing the competitive advantage of core business is also the choice of Changjiang Electronics Technology. Yu Kangkang believes that in order to seek higher development, it is necessary to accelerate technological innovation and foster and enhance the competitive advantage of core businesses. According to Yu Kangkang, Changdian Technology will transfer its investment focus to high-tech products with independent intellectual property rights, and shift its development focus to the development and application of packaging technologies such as system integration packages (Sip, TSV) in the world's leading edge. Innovative ability, as the central link to transform the economic growth mode, strives to promote the industrialization of scientific and technological achievements, and launch new products that are competitive and welcomed by the market, such as USB, SD, LGA, etc., to form new economic growth points as soon as possible. In addition, changing the business model, from scale expansion and investment-driven to research and development, brand management is also an important measure for Changdian to successfully respond to the crisis. "Change a single specialized OEM model, use new technology to extend the industrial chain to the development of terminal electronic consumer products, brand sales have begun to take shape, and further expand the sales of self-owned brand digital products. At present, the sales area has covered Jiangsu, Zhejiang and Shanghai. In Sichuan and other places, there are more than 40 3C stores, which have gradually formed new growth points, which is of great significance for improving profitability." Yu Kangkang believes.
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