Lao Xing Comments: Join hands with Haisi, Changhong promotes IoT chip application and technology upgrade

Comments: Join hands with Haisi, Changhong promotes IoT chip application and technology upgrade
1. The Internet of Things is a digital composite system integrating sensing, communication, network, computing and control technologies. The Internet of Things application will cover all fields of national economy and social services. It is recognized as the world's information industry after computers and the Internet. The third wave is the next trillion-level industry.
2. The Internet of Things issues are overwhelming, and the related applications are diversified, which also provides great room for innovation. However, based on the current application on the market, it can be roughly divided into smart home, smart transportation, smart medical, smart energy, smart industry and other application types, aiming at the huge business opportunities in these fields.
3. To win the market, vendors need a broad portfolio of technologies that cover processors, sensing, and communications, as well as protocols that combine these technologies, and ultimately ensure the security of product services. You also need to create your own hub node products or find similar products to work together to connect all your devices. At present, no chip or system manufacturer has all these combinations of elements, so cooperation is the mainstream of the Internet of Things industry to provide more complete IoT products and services.

4. The strategies for major companies to enter the IoT market vary widely, and each company attempts to leverage its strengths to compete for market share. As the core device of the Internet of Things, the chip is at the core of all applications of the Internet of Things. Haisi has an industry leading level in all kinds of home appliance control main chip and IoT chip technology and application. Changhong and Haisi form a strategic cooperation and will share resources, technologies and talents in the field of “Internet of Things” to promote the development of the “Internet of Things” industry.

Rectangular I/O Connectors

Rectangular I/O Connectors
Antenk offers an expansive product line of I/O connectors including USB, HDMI, D-Sub, Modular Jacks, SFP, QSFP+, CXP, iPass+, iPass+ HD and more. In addition to standard I/O connectors and matching cable assemblies.Except a comprehensive range of standard Input/Output connector solutions for high-speed electronic data communication, Antenk engineers can design customized solutions. This extensive selection of I/O connectors and matching cable assemblies includes numerous next-generation solutions.All of our I/O connectors feature a variety of orientation options, as well as PCB and cable mount offerings.

Antenk develop and specify high-performance I/O's throughout a wide variety of industries. These include SAS, SATA, PCIe, HSSG, FIBRE CHANNEL, INFINIBAND, IEC, CEA, IEEE, VESA, USB and many more.


I/O Connectors Application
Consumer / PC Products
Networking / Telecommunications Products
Mobile Products
Industrial Products

Antenk can deliver standard and custom options of the following I/O connectors:
1394 Connector
Centronic Connector
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I/O Connectors General Specifications

AF chen SMT-USBIMG_0886-USB

ELECTRICAL CHARACTERISTICS
Contact Current Rating:5Amperes.
Dielectric Withstanding.
Dielectric Withstanding Voltage:AC 1000Vr.m.s.
Insulation Resistance:500 Megohms Minimum at DC500V.
Contact Resistance:25 Milliohms Maximum.
Operating Temperature:-55℃~105℃.

DP01-FXXXXX D-SUB PCB Female Dual Row Straight(stamped Pin)

MATERIALS:
Contacts:Brass.
Insulator:PBT,UL94V-O Rated.
Shell:Cold Rolle Steel.
Metal Watertight Frame:PBT,UL94V-0.
O-Ring:Silicone.

NOTE:
Position:09PIN,15PIN,25PIN,37PIN.




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