1. Process: a) Cleaning: Ultrasonic cleaning of PCB or LED bracket and drying. b) Mounting: After the silver electrode is placed on the bottom electrode of the LED die (large wafer), the expansion is performed, and the expanded die (large wafer) is placed on the thorn crystal table, and the die is punched under the microscope with a stylus. One by one is mounted on the corresponding pad of the PCB or LED holder, and then sintered to cure the silver paste. c) Pressure welding: The electrode is connected to the LED die by an aluminum wire or gold wire welder for current injection. The LED is directly mounted on the PCB, and an aluminum wire welder is generally used. (Making a white light TOP-LED requires a gold wire bonder) d) Packaging: By dispensing, the LED die and wire are protected with epoxy. Dispensing on the PCB, there are strict requirements on the shape of the gel after curing, which is directly related to the brightness of the backlight product. This process will also take on the task of a point phosphor (white LED). e) Soldering: If the backlight is an SMD-LED or other packaged LED, the LED needs to be soldered to the PCB before the assembly process. f) Film cutting: Various diffusion films, reflective films, etc. required for backlighting are punched by a punch. g) Assembly: Manually install the various materials of the backlight in the correct position according to the drawings. h) Test: Check whether the photoelectric parameters of the backlight and the uniformity of light output are good. Packing: Pack the finished product as required and put it into storage.
Second, the packaging process 1. The task of LED packaging is to connect the external leads to the electrodes of the LED chip, while protecting the LED chip, and to improve the efficiency of light extraction. The key processes are mounting, pressure welding and packaging. 2. LED package form LED package can be said to be varied, mainly according to different applications, the corresponding size, cooling countermeasures and light-emitting effects. LEDs are classified into Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, etc. in package form. 3. LED packaging process
4. Package process description
1. Chip inspection microscopic inspection: whether there is mechanical damage on the surface of the material and the lockhill. Whether the chip size and electrode size meet the process requirements, whether the electrode pattern is complete 2
2 The expansion of the LED chip is still very close (about 0.1 mm) after dicing, which is not conducive to the operation of the post-process. We use a film expander to expand the film of the bonded chip, and the distance between the LED chips is stretched to about 0.6 mm. It can also be manually expanded, but it is easy to cause problems such as chip falling waste.
3. Dispense the silver glue or insulating glue on the corresponding position of the LED bracket. (For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes, silver paste is used. For blue and green LED chips of sapphire insulated substrates, insulating paste is used to fix the chips.) In the control of the amount of dispensing, there are detailed technical requirements in the height of the glue and the position of the dispensing. Since silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters that must be paid attention to in the process.
4. In addition to the glue and the glue, the glue is applied to the back electrode of the LED by the glue machine, and then the LED with the silver glue on the back is mounted on the LED bracket. The efficiency of the preparation glue is much higher than that of the dispensing, but not all products are suitable for the preparation process.
5. The hand-piercing piece will be placed on the jig of the lancet table after the expansion of the LED chip (with or without glue), the LED holder is placed under the clamp, and the LED chip is punctured to the corresponding position by the needle under the microscope. . Hand-made thorns have an advantage over automatic loading, making it easy to replace different chips at any time, suitable for products that require multiple chips.
6. Automatic loading and unloading is actually a combination of two steps of glue (dispensing) and mounting the chip. First, silver glue (insulating glue) is placed on the LED bracket, and then the LED chip is sucked up and moved by a vacuum nozzle. The position is then placed in the corresponding bracket position. In the process of automatic loading, the equipment should be familiar with the operation and programming of the equipment, and at the same time adjust the glue and installation accuracy of the equipment. In the selection of the nozzle, the bakelite nozzle should be used as much as possible to prevent damage to the surface of the LED chip. In particular, the blue and green chips must be made of bakelite. Because the steel nozzle will scratch the current diffusion layer on the surface of the chip.
7. The purpose of sintering and sintering is to cure the silver paste. The sintering requires monitoring the temperature to prevent batch defects. The temperature at which the silver paste is sintered is generally controlled at 150 ° C and the sintering time is 2 hours. According to the actual situation, it can be adjusted to 170 ° C for 1 hour. The insulating glue is generally 150 ° C for 1 hour. The silver-glued sintering oven must be opened and replaced with a sintered product within 2 hours (or 1 hour) according to the process requirements, and should not be opened at will. Sintering ovens must not be used for other purposes to prevent contamination.
8. The purpose of pressure welding and welding is to lead the electrode to the LED chip to complete the connection of the inner and outer leads of the product. There are two kinds of LED pressure welding processes: gold wire ball bonding and aluminum wire pressure welding. The picture on the right is the process of aluminum wire bonding. First, press the first point on the electrode of the LED chip, then pull the aluminum wire over the corresponding bracket, and press the second point to tear the aluminum wire. The gold wire ball bonding process burns the ball before the first point, and the rest of the process is similar. Pressure welding is a key link in LED packaging technology. The main requirements of the process are the pressure welding of gold wire (aluminum wire) arch shape, solder joint shape, and tensile force. In-depth research on the pressure welding process involves many problems, such as gold (aluminum) wire material, ultrasonic power, pressure welding pressure, boring tool (steel nozzle) selection, boring tool (steel mouth) trajectory and so on. (The figure below is a micrograph of the solder joints from two different boring tools under the same conditions. The difference in microstructure between the two is related to the quality of the product.) We will not repeat them here.
9. The package of the LED packaged LED is mainly made of glue, potting and molding. Basically, the difficulty of process control is bubbles, lack of materials, and black spots. The design is mainly for the selection of materials, and the combination of good epoxy and brackets is selected. (General LEDs cannot pass the airtightness test) The TOP-LED and Side-LED shown in the right figure are suitable for dispensing. Manual dispensing requires a high level of operation (especially white LEDs). The main difficulty is the control of the amount of dispensing, as the epoxy thickens during use. The dispensing of white LEDs also has the problem of phosphor precipitation leading to chromatic aberration of light.
10. Potting package Lamp-LED package is in the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy, and then remove the LED from the cavity to form.
11. Molded package The pressure-welded LED bracket is placed in the mold, and the upper and lower molds are clamped by a hydraulic machine and vacuumed, and the solid epoxy is placed in the inlet of the injection line to be pressed into the mold rubber path by the hydraulic ejector. The epoxy enters each LED forming groove along the glue path and solidifies.
12. Curing and post-cure curing refers to the curing of the encapsulating epoxy, which is generally cured at 135 ° C for 1 hour. The molded package is typically at 150 ° C for 4 minutes.
13. Post-cure and post-cure is to fully cure the epoxy while heat-aging the LED. Post-cure is important to increase the bond strength of the epoxy to the support (PCB). The general conditions are 120 ° C for 4 hours.
14. Cutting and dicing Because LEDs are connected together in production (not single), Lamp-packaged LEDs use ribs to cut the ribs of the LED holder. SMD-LED is on a PCB board and requires a dicing machine to complete the separation.
15. Test and test the photoelectric parameters of the LED, check the external dimensions, and dilute the LED products according to customer requirements.
16. Packaging The finished product is counted and packaged. Ultra-bright LEDs require anti-static packaging.
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Second, the packaging process 1. The task of LED packaging is to connect the external leads to the electrodes of the LED chip, while protecting the LED chip, and to improve the efficiency of light extraction. The key processes are mounting, pressure welding and packaging. 2. LED package form LED package can be said to be varied, mainly according to different applications, the corresponding size, cooling countermeasures and light-emitting effects. LEDs are classified into Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-Power-LED, etc. in package form. 3. LED packaging process
4. Package process description
1. Chip inspection microscopic inspection: whether there is mechanical damage on the surface of the material and the lockhill. Whether the chip size and electrode size meet the process requirements, whether the electrode pattern is complete 2
2 The expansion of the LED chip is still very close (about 0.1 mm) after dicing, which is not conducive to the operation of the post-process. We use a film expander to expand the film of the bonded chip, and the distance between the LED chips is stretched to about 0.6 mm. It can also be manually expanded, but it is easy to cause problems such as chip falling waste.
3. Dispense the silver glue or insulating glue on the corresponding position of the LED bracket. (For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes, silver paste is used. For blue and green LED chips of sapphire insulated substrates, insulating paste is used to fix the chips.) In the control of the amount of dispensing, there are detailed technical requirements in the height of the glue and the position of the dispensing. Since silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters that must be paid attention to in the process.
4. In addition to the glue and the glue, the glue is applied to the back electrode of the LED by the glue machine, and then the LED with the silver glue on the back is mounted on the LED bracket. The efficiency of the preparation glue is much higher than that of the dispensing, but not all products are suitable for the preparation process.
5. The hand-piercing piece will be placed on the jig of the lancet table after the expansion of the LED chip (with or without glue), the LED holder is placed under the clamp, and the LED chip is punctured to the corresponding position by the needle under the microscope. . Hand-made thorns have an advantage over automatic loading, making it easy to replace different chips at any time, suitable for products that require multiple chips.
6. Automatic loading and unloading is actually a combination of two steps of glue (dispensing) and mounting the chip. First, silver glue (insulating glue) is placed on the LED bracket, and then the LED chip is sucked up and moved by a vacuum nozzle. The position is then placed in the corresponding bracket position. In the process of automatic loading, the equipment should be familiar with the operation and programming of the equipment, and at the same time adjust the glue and installation accuracy of the equipment. In the selection of the nozzle, the bakelite nozzle should be used as much as possible to prevent damage to the surface of the LED chip. In particular, the blue and green chips must be made of bakelite. Because the steel nozzle will scratch the current diffusion layer on the surface of the chip.
7. The purpose of sintering and sintering is to cure the silver paste. The sintering requires monitoring the temperature to prevent batch defects. The temperature at which the silver paste is sintered is generally controlled at 150 ° C and the sintering time is 2 hours. According to the actual situation, it can be adjusted to 170 ° C for 1 hour. The insulating glue is generally 150 ° C for 1 hour. The silver-glued sintering oven must be opened and replaced with a sintered product within 2 hours (or 1 hour) according to the process requirements, and should not be opened at will. Sintering ovens must not be used for other purposes to prevent contamination.
8. The purpose of pressure welding and welding is to lead the electrode to the LED chip to complete the connection of the inner and outer leads of the product. There are two kinds of LED pressure welding processes: gold wire ball bonding and aluminum wire pressure welding. The picture on the right is the process of aluminum wire bonding. First, press the first point on the electrode of the LED chip, then pull the aluminum wire over the corresponding bracket, and press the second point to tear the aluminum wire. The gold wire ball bonding process burns the ball before the first point, and the rest of the process is similar. Pressure welding is a key link in LED packaging technology. The main requirements of the process are the pressure welding of gold wire (aluminum wire) arch shape, solder joint shape, and tensile force. In-depth research on the pressure welding process involves many problems, such as gold (aluminum) wire material, ultrasonic power, pressure welding pressure, boring tool (steel nozzle) selection, boring tool (steel mouth) trajectory and so on. (The figure below is a micrograph of the solder joints from two different boring tools under the same conditions. The difference in microstructure between the two is related to the quality of the product.) We will not repeat them here.
9. The package of the LED packaged LED is mainly made of glue, potting and molding. Basically, the difficulty of process control is bubbles, lack of materials, and black spots. The design is mainly for the selection of materials, and the combination of good epoxy and brackets is selected. (General LEDs cannot pass the airtightness test) The TOP-LED and Side-LED shown in the right figure are suitable for dispensing. Manual dispensing requires a high level of operation (especially white LEDs). The main difficulty is the control of the amount of dispensing, as the epoxy thickens during use. The dispensing of white LEDs also has the problem of phosphor precipitation leading to chromatic aberration of light.
10. Potting package Lamp-LED package is in the form of potting. The potting process is to first inject liquid epoxy into the LED molding cavity, then insert the pressure-bonded LED bracket into the oven to cure the epoxy, and then remove the LED from the cavity to form.
11. Molded package The pressure-welded LED bracket is placed in the mold, and the upper and lower molds are clamped by a hydraulic machine and vacuumed, and the solid epoxy is placed in the inlet of the injection line to be pressed into the mold rubber path by the hydraulic ejector. The epoxy enters each LED forming groove along the glue path and solidifies.
12. Curing and post-cure curing refers to the curing of the encapsulating epoxy, which is generally cured at 135 ° C for 1 hour. The molded package is typically at 150 ° C for 4 minutes.
13. Post-cure and post-cure is to fully cure the epoxy while heat-aging the LED. Post-cure is important to increase the bond strength of the epoxy to the support (PCB). The general conditions are 120 ° C for 4 hours.
14. Cutting and dicing Because LEDs are connected together in production (not single), Lamp-packaged LEDs use ribs to cut the ribs of the LED holder. SMD-LED is on a PCB board and requires a dicing machine to complete the separation.
15. Test and test the photoelectric parameters of the LED, check the external dimensions, and dilute the LED products according to customer requirements.
16. Packaging The finished product is counted and packaged. Ultra-bright LEDs require anti-static packaging.
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