Packaging equipment - localization of wire bonding machine "long road"

[Text / High-tech Research Institute LED Research Institute (GGII)] In the LED accessory equipment industry, the localization rate of equipment with higher requirements on process technology, precision and stability is often lower. As far as the status quo of LED equipment industry is concerned, the technical requirements for LED downstream equipment are relatively low, the localization rate is the highest, the midstream package supporting equipment is second, and the upstream chip equipment, especially MOCVD localization rate is the lowest.

In terms of LED packaging equipment, the market structure around 2009 is that ASM, K&S, Kaijo, Musashi and other imported equipment manufacturers occupy the absolute market share of the LED packaging equipment industry. However, after years of development, the market structure has undergone significant changes, and the yield of LED packaging equipment, especially the back-end equipment, has increased significantly. The reason is that on the one hand, the technology and performance of domestic equipment are gradually improved, and the quality of equipment is continuously improved. On the other hand, the competition in China's LED packaging industry is becoming more and more fierce, the price of packaged devices continues to decline rapidly, and the corporate profits are declining. The packaging manufacturer purchases domestic equipment in batches for cost control.

According to the research of the High-tech Research Institute LED Research Institute (GGII), the localization rate of newly added equipment for the back-end spectroscopic tape machine is over 95%; the localization rate of new equipment for dispensers and solid crystal machines exceeds 70%, and the welding line The rate of newly added equipment is relatively low. At present, ASM, K&S and Kaijo are the three giants in China's LED wire bonding machine industry. The market share of the three is more than 80%, among which ASM has the highest market share. In terms of domestic wire bonding machines, the market share of manufacturers represented by Dazu Laser and Cui Tao is only about 15%.

Compared with the imported wire bonding machine, the production capacity of the domestic wire bonding machine is almost the same as that of the imported equipment, but there is still a certain gap in its stability. In addition, imported second-hand equipment has a relatively high impact on domestic wire bonding equipment because of its low price and good stability. The localization rate of the wire bonding machine is low due to various reasons, and the localization of the wire bonding machine in the future is “long road”.

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