[Source: Gaogong LED's "LED Good Products" magazine February issue / He Wei] With the improvement of light efficiency, the LED application market is gradually maturing, users have higher and higher requirements for product stability and reliability, especially Under the same conditions, products are required to achieve better energy efficiency indicators, lower power consumption and more competitive product prices.
This is particularly evident in the domestic packaging industry in the past year.
“The market advantage of 1W imitation lumens will be smaller and smaller, and will eventually be replaced by 3535 and COB.†Wu Jianfang, deputy general manager of Shenzhen Ruiguangheng Technology Co., Ltd., who has been focusing on high-power LEDs for the past few years. COB LED packaging companies have gradually established their own capacity advantages in the above market segments.
The reporter learned that the current spotlights have begun to adopt COB packaging gradually, and the heat dissipation of 3535 is better than 1W imitation lumens. More of them are used in street lamps. The development of technology has determined that the replacement of 1W imitation lumens is an inevitable trend.
"Although China lacks original packaging technology, after the introduction, absorption, digestion and improvement, some companies' LED packaging technology has been comparable to internationally advanced LED packaging companies in certain areas." Wu Jianfang pointed out.
The COB era is coming
The COB integrated packaging technology directly encapsulates a plurality of LED chips on a metal-based printed circuit board, and directly dissipates heat through the substrate as a lighting module, which not only reduces the manufacturing process and cost of the bracket, but also has the heat dissipation advantage of reducing thermal resistance.
In fact, the integrated COB package has been popular for a while in the past few years, and then returned to silence. In the past two years, the integrated COB package has once again been “favoredâ€. In this regard, Wu Jianfang said that COB packaging was once popular because people were more concerned with the simplicity and cost advantages of structure and application, but at the time of technology maturity, manufacturing process, material supply, product performance and reliability. There are occasional thresholds that can't be exceeded.
Since 2012, the technology of COB light source packaging has been greatly improved, the manufacturing process has become more mature in industrialization, the material supply has been well protected, and the performance and reliability of light source products have been significantly improved, which has once again received attention. Very normal. "COB package can divide one or two large chips into more than a dozen small chips, which can be made smaller and the horizontal heat dissipation efficiency is higher. From the vertical point of view, the COB package can achieve better in a limited volume. Efficiency, so it has a good performance in both horizontal and vertical heat dissipation." Wu Jianfang pointed out.
The cost advantage is also the focus of the integrated COB package. Wu Jianfang pointed out that compared with the traditional LED SMD chip package and high power package, the COB package can directly package multiple chips on the metal-based printed circuit board MCPCB through the substrate. Direct heat dissipation can reduce the manufacturing process and cost of the bracket. “COB package forms a circuit connection by directly bonding or soldering the chip to the heat sink. Only one package can simplify the secondary light distribution, which has a cost advantage and is about 30% lower than the cost of the general LED package.â€
The reporter learned that the mainstream bulbs in the market mainly use SMD5730 and 2835 packaged devices, and COB only accounts for about 40% of the total. However, Wu Jianfang believes that COB will completely replace 5730 and 2835 in the near future.
Unfinished: For more information, please check the February issue of Gaogong LED's "LED Good Products" magazine.
This is particularly evident in the domestic packaging industry in the past year.
“The market advantage of 1W imitation lumens will be smaller and smaller, and will eventually be replaced by 3535 and COB.†Wu Jianfang, deputy general manager of Shenzhen Ruiguangheng Technology Co., Ltd., who has been focusing on high-power LEDs for the past few years. COB LED packaging companies have gradually established their own capacity advantages in the above market segments.
The reporter learned that the current spotlights have begun to adopt COB packaging gradually, and the heat dissipation of 3535 is better than 1W imitation lumens. More of them are used in street lamps. The development of technology has determined that the replacement of 1W imitation lumens is an inevitable trend.
"Although China lacks original packaging technology, after the introduction, absorption, digestion and improvement, some companies' LED packaging technology has been comparable to internationally advanced LED packaging companies in certain areas." Wu Jianfang pointed out.
The COB era is coming
The COB integrated packaging technology directly encapsulates a plurality of LED chips on a metal-based printed circuit board, and directly dissipates heat through the substrate as a lighting module, which not only reduces the manufacturing process and cost of the bracket, but also has the heat dissipation advantage of reducing thermal resistance.
In fact, the integrated COB package has been popular for a while in the past few years, and then returned to silence. In the past two years, the integrated COB package has once again been “favoredâ€. In this regard, Wu Jianfang said that COB packaging was once popular because people were more concerned with the simplicity and cost advantages of structure and application, but at the time of technology maturity, manufacturing process, material supply, product performance and reliability. There are occasional thresholds that can't be exceeded.
Since 2012, the technology of COB light source packaging has been greatly improved, the manufacturing process has become more mature in industrialization, the material supply has been well protected, and the performance and reliability of light source products have been significantly improved, which has once again received attention. Very normal. "COB package can divide one or two large chips into more than a dozen small chips, which can be made smaller and the horizontal heat dissipation efficiency is higher. From the vertical point of view, the COB package can achieve better in a limited volume. Efficiency, so it has a good performance in both horizontal and vertical heat dissipation." Wu Jianfang pointed out.
The cost advantage is also the focus of the integrated COB package. Wu Jianfang pointed out that compared with the traditional LED SMD chip package and high power package, the COB package can directly package multiple chips on the metal-based printed circuit board MCPCB through the substrate. Direct heat dissipation can reduce the manufacturing process and cost of the bracket. “COB package forms a circuit connection by directly bonding or soldering the chip to the heat sink. Only one package can simplify the secondary light distribution, which has a cost advantage and is about 30% lower than the cost of the general LED package.â€
The reporter learned that the mainstream bulbs in the market mainly use SMD5730 and 2835 packaged devices, and COB only accounts for about 40% of the total. However, Wu Jianfang believes that COB will completely replace 5730 and 2835 in the near future.
Unfinished: For more information, please check the February issue of Gaogong LED's "LED Good Products" magazine.
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