The Stamped Circuit Board (SCB) technology is an innovative solution developed by the German Heraeus Group for LED package substrates. With SCB technology, precise structure and multilayer film suppression can be achieved in high-efficiency roll-to-roll mass production. With the same excellent heat dissipation capability, SCB technology is less expensive and is an ideal alternative to LED ceramic panels.
LED luminous flux, efficiency and lifetime depend to a large extent on the junction temperature of the interface between the layers of material (Junction Temp). Any rise in component temperature will have a negative impact on the surface of the LED. Therefore, it is especially important to set up an effective cooling system. The LED assembly can be placed directly onto the existing metal layer and attached to the back side of the metal using a metal fixing material (also produced by Heraeus Heraeus, Germany). Thus, thermal energy can pass through the conductive copper metal layer and dissipate directly from the wafer. The use of high-conductivity LED substrates can significantly increase heat dissipation (up to 380W/mK) and provide an effective thermal management solution for a variety of wafer types (CoB or multi-array arrays).
In general, the SCB technology used in the substrate using crystal as a carrier determines its good electrothermal performance and plays a key role in the development and application of many heat transfer metals and metal alloys.
For high-brightness module components, experts have considered three substrate solutions: printed circuit board (PCB), injection-molded composite (overmolded stamping), and molded circuit boards. After thermal analysis, the substrate was carefully and thoroughly examined in terms of structure, materials, and thermal interface materials (TIM). In addition, factors affecting thermal management were examined. The main concerns include:
1. LED chip itself (structure, size)
2. LED chip mounting (connection type: conductive adhesive, solder, silver sintered, etc.).
3. PCB connection (size)
4. Substrate (technology, materials and dimensions)
IZM's HB-LED analysis shows that the choice of optimized materials can reduce the junction temperature (Tj) by 3 °C, and with an optimized design, even in short-term or long-term lighting applications, the Tj temperature can be reduced by 10 °C. Compared with traditional technologies, SCB technology has great potential in thermal management, and SCB technology makes LEDs smarter.
LED luminous flux, efficiency and lifetime depend to a large extent on the junction temperature of the interface between the layers of material (Junction Temp). Any rise in component temperature will have a negative impact on the surface of the LED. Therefore, it is especially important to set up an effective cooling system. The LED assembly can be placed directly onto the existing metal layer and attached to the back side of the metal using a metal fixing material (also produced by Heraeus Heraeus, Germany). Thus, thermal energy can pass through the conductive copper metal layer and dissipate directly from the wafer. The use of high-conductivity LED substrates can significantly increase heat dissipation (up to 380W/mK) and provide an effective thermal management solution for a variety of wafer types (CoB or multi-array arrays).
In general, the SCB technology used in the substrate using crystal as a carrier determines its good electrothermal performance and plays a key role in the development and application of many heat transfer metals and metal alloys.
For high-brightness module components, experts have considered three substrate solutions: printed circuit board (PCB), injection-molded composite (overmolded stamping), and molded circuit boards. After thermal analysis, the substrate was carefully and thoroughly examined in terms of structure, materials, and thermal interface materials (TIM). In addition, factors affecting thermal management were examined. The main concerns include:
1. LED chip itself (structure, size)
2. LED chip mounting (connection type: conductive adhesive, solder, silver sintered, etc.).
3. PCB connection (size)
4. Substrate (technology, materials and dimensions)
IZM's HB-LED analysis shows that the choice of optimized materials can reduce the junction temperature (Tj) by 3 °C, and with an optimized design, even in short-term or long-term lighting applications, the Tj temperature can be reduced by 10 °C. Compared with traditional technologies, SCB technology has great potential in thermal management, and SCB technology makes LEDs smarter.
(This article is submitted by German Heraeus)
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