The power consumption of human beings for lighting accounts for about 20% of the total electricity consumption in the world. Therefore, how to save electricity for lighting has become a serious concern of governments, the scientific and technological circles and industry in the world.
High-brightness light-emitting diodes (LEDs) are becoming a new generation of light sources for upgrading the traditional lighting industry because of their low power consumption, long life, fast response, no stroboscopic, small size, no pollution, and easy integration. Today, with the theme of energy conservation, emission reduction and environmental protection, semiconductor lighting has become a new economic growth point. Therefore, it has been highly valued by governments, science and technology and industry around the world. So far, the United States, Japan, Europe, China and China Taiwan and other companies have launched their own semiconductor lighting plans. The high-power LED lighting industry has become one of the most watched industries. In the future, it is likely to develop into a large industry with a scale of over US$100 million. A revolution in the lighting industry has quietly advent.
A noteworthy objective fact is that the upstream epitaxial chip technology has basically matured and shaped, and the cheap and good chips have been able to meet the lighting demand. Now the pricing power is shifting and developing in the midstream packaging and downstream application terminal market. This means that who can apply the chip to create long-life, high-efficiency high-power LED lighting, who is likely to become the ultimate winner of the LED industry. The problems of high-power LED lighting package and application are highlighted. The most critical issue is how to solve the heat dissipation problem of high-power LED lighting. This is not only a technical problem such as structural design and engineering application, but also a thermal management mode. And scientific issues such as fluid mechanics.
This paper aims to analyze the current status of high-power LED lighting technology "chip-aluminum substrate-heater three-layer structure mode", and propose a new technical route for high-power LED lighting. On this basis, a brief introduction to "chip-heat dissipation" The integrated (two-layer structure) mode technology, in turn, gives the choice direction of the (integrated) high-power LED lighting technology route.
For more information, please refer to the March issue of "High-tech LED-Technology and Applications" magazine
1.ANTENK Wire to Board connectors are avialable in different terminations and sizes intended for use on a variety of applications. These connectors provide power and signal with different body styles, termination options, and centerlines. To find the wire to board set required, click on the appropriate sub section below.
2.Our products are widely used in electronic equipments,such as monitors ,electronic instruments,computer motherboards,program-controlled switchboards,LED,digital cameras,MP4 players,a variety of removable storage disks,cordless telephones,walkie-talkies,mobile phones,digital home appliances and electronic toys,high-speed train,aviation,communication station,Military and so on
Antenk Wire To Board Connectors Ranges:
Power Wire to Board
IDC Wire to Board
Locking Wire to Board
Latching Wire to Board
Fine Pitch Wire to Board
Wire to Board Connectors Information
Description
Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires.
Specifications
Specifications for a wire to board connector include the following.
Wire-entry angle - There are three wire-entry angle styles: vertical, right-angle, and bottom-entry.
Wire size - Wire size is usually measured in American wire gauge (AWG), a standard for non-ferrous wire conductor sizes. The term "gauge" refers to the wire`s diameter. The higher the gauge number, the smaller the diameter and the thinner the wire.
Circuits or positions - With wire to board connectors, the number of circuits or positions may range from 1 to 120.
Pitch or center spacing - Pitch or center spacing is measured in millimeters (mm) or inches.
Lock to mating style - There are three basic lock-to-mating styles: positive, friction, and friction ramp.
Maximum current - The maximum current or current-carrying capacity is measured in amperes (A) and ranges from 1.0 A to 50. A.
Termination Methods
Crimp is the physical compression of a contact wire around a conductor to make an electrical and mechanical connection. Insulation displacement connectors (IDC) slice through the cable insulation to make a connection. Choices for termination method also include cage clamp, screw, tabs, and solder cups.
PCB Mounting Styles
With wire to board connectors, there are four choices for PCB mounting.
Through-hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux.
Press-fit and compression-style Board To Board Connectors are also commonly available.Wire to Board Connectors Information
Standards
Wire-to-board connectors carry approvals from various national and international organizations. In North America, they often bear marks from Underwriters Laboratories (UL) and/or the Canadian Standards Association (CSA).
A wire to board connector for the European marketplace should comply with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives from the European Union (EU). Wire-to-board connectors that comply with other requirements are also available.
BS 9526 N0001 - Specification for multi-contact edge socket electrical connectors.
Wire To Board Connectors,Wire Harness,Pcb Wire To Board Connector,Pin Wire To Board Connector,IDC Wire to Board,Locking Wire to Board,Latching Wire to Board,Fine Pitch Wire to Board
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