[Text|High- tech LED reporter Luo Shenghua] "Under the influence of technology, the domestic high-end automatic wire bonding machine is still monopolized by foreign companies." Lu Liangjun, sales department of Shenzhen Cuitao Automation Equipment Co., Ltd. told the reporter of "High-tech LED".
Founded in 2005, Cui Tao Automation is committed to being a world-class supplier of semiconductor packaging equipment, including solid crystal machines, wire bonding machines, glue dispensers, and dispensers. On November 9, 2011, the Tsui Tao Automation Semiconductor Packaging Equipment Base project was officially signed and settled in Dongjiang High-tech Industrial Park. The base project is expected to have a total investment of 300 million yuan, specializing in the production of semiconductor packaging equipment.
As one of the core equipments in the LED packaging industry, the wire bonding machine is responsible for connecting the two electrodes of the chip and the bracket, which is the most critical part of the whole packaging process. The product technology has many difficulties and can best reflect the competitive advantage of the enterprise. In addition, due to its sophisticated automation control and high-precision wire bonding requirements that domestic equipment cannot meet, it has been monopolized by foreign companies represented by ASM.
In order to fill the gap of domestic high-end automatic high-precision ultrasonic wire bonding machine equipment and accelerate the pace of China's semiconductor manufacturing industry chain to high-end, in August last year, Cui Tao automation research and development production of fully automatic high-precision ultrasonic wire bonding machine put into the market .
"Full-automatic ultrasonic wire bonding machine" is a method of connecting the chip and the bracket by soldering after the die-bonding of the semiconductor device in the production process of the semiconductor device, thereby realizing the connection between the internal chip and the external pin, and establishing the chip and the external Electrical connection ensures an important role in the smooth flow of input and output between the chip and the outside world. Can be widely used in various fields of IC and LED.
According to reports, the high-speed motion platform of Cui Tao Automation's fully automatic high-precision ultrasonic wire bonding machine uses high-precision grating scale to achieve a detection error of ±2nm. The operation control technology adopts 4-axis control card and closed-loop control of servo motor to achieve motion accuracy ±1?m.
In addition, the USG control technology uses a closed circuit developed by independent innovation to achieve constant current, real-time frequency locking of welding ultrasound and improve welding stability. The EFO control technology adopts the technology developed by independent innovation, which can achieve high-voltage current above 4000V, and subtle level control to ensure the quality of the ball.
"The successful development of this project will quickly improve the overall level of China's semiconductor manufacturing industry chain, breaking the situation that domestic high-end automation equipment is monopolized by foreign countries." Lu Liangjun told reporters.
It is understood that from the time of the launch to June this year, the order of this product has exceeded 200 units, which has been recognized by the market.
In order to better display this product, the company will bring products to participate in the 2014 Golden Globe Awards sponsored by senior engineers, hoping to gain some.
At present, the 2014 (5th) High-tech Golden Globe Award - the annual LED good product selection has entered the WeChat voting stage: August 8 - September 30.
If you have already paid attention to the official WeChat LED, please click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat of Gaogong LED Network to vote.
If you have not paid attention to the high-tech LED WeChat, please pay attention to the official WeChat (micro-signal: weixin-gg-led) of Gaogong LED network, and then click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat LED official website. .
Founded in 2005, Cui Tao Automation is committed to being a world-class supplier of semiconductor packaging equipment, including solid crystal machines, wire bonding machines, glue dispensers, and dispensers. On November 9, 2011, the Tsui Tao Automation Semiconductor Packaging Equipment Base project was officially signed and settled in Dongjiang High-tech Industrial Park. The base project is expected to have a total investment of 300 million yuan, specializing in the production of semiconductor packaging equipment.
As one of the core equipments in the LED packaging industry, the wire bonding machine is responsible for connecting the two electrodes of the chip and the bracket, which is the most critical part of the whole packaging process. The product technology has many difficulties and can best reflect the competitive advantage of the enterprise. In addition, due to its sophisticated automation control and high-precision wire bonding requirements that domestic equipment cannot meet, it has been monopolized by foreign companies represented by ASM.
In order to fill the gap of domestic high-end automatic high-precision ultrasonic wire bonding machine equipment and accelerate the pace of China's semiconductor manufacturing industry chain to high-end, in August last year, Cui Tao automation research and development production of fully automatic high-precision ultrasonic wire bonding machine put into the market .
"Full-automatic ultrasonic wire bonding machine" is a method of connecting the chip and the bracket by soldering after the die-bonding of the semiconductor device in the production process of the semiconductor device, thereby realizing the connection between the internal chip and the external pin, and establishing the chip and the external Electrical connection ensures an important role in the smooth flow of input and output between the chip and the outside world. Can be widely used in various fields of IC and LED.
According to reports, the high-speed motion platform of Cui Tao Automation's fully automatic high-precision ultrasonic wire bonding machine uses high-precision grating scale to achieve a detection error of ±2nm. The operation control technology adopts 4-axis control card and closed-loop control of servo motor to achieve motion accuracy ±1?m.
In addition, the USG control technology uses a closed circuit developed by independent innovation to achieve constant current, real-time frequency locking of welding ultrasound and improve welding stability. The EFO control technology adopts the technology developed by independent innovation, which can achieve high-voltage current above 4000V, and subtle level control to ensure the quality of the ball.
"The successful development of this project will quickly improve the overall level of China's semiconductor manufacturing industry chain, breaking the situation that domestic high-end automation equipment is monopolized by foreign countries." Lu Liangjun told reporters.
It is understood that from the time of the launch to June this year, the order of this product has exceeded 200 units, which has been recognized by the market.
In order to better display this product, the company will bring products to participate in the 2014 Golden Globe Awards sponsored by senior engineers, hoping to gain some.
At present, the 2014 (5th) High-tech Golden Globe Award - the annual LED good product selection has entered the WeChat voting stage: August 8 - September 30.
If you have already paid attention to the official WeChat LED, please click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat of Gaogong LED Network to vote.
If you have not paid attention to the high-tech LED WeChat, please pay attention to the official WeChat (micro-signal: weixin-gg-led) of Gaogong LED network, and then click on the menu bar "Golden Ball Award - I want to vote" under the official WeChat LED official website. .
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