With the development of design and manufacturing technology, integrated circuit design has evolved from transistor integration to logic gate integration, and now it has evolved into IP integration, SoC (System-on-a-Chip) design technology. SoC can effectively reduce the development cost of electronic/information system products, shorten the development cycle, and improve the competitiveness of products. It is the most important product development method that the industry will adopt in the future. Although the term SoC has been around for many years, there are different opinions about what SoC is. After years of debate, the experts reached an agreement on the definition of SoC. Although this definition is not very strict, it clearly shows the characteristics of the SoC:
VLSI for complex system functions; ultra-deep sub-micron process technology;
Use more than one embedded CPU/digital signal processor (DSP);
The chip can be programmed externally;
About SoC chipThe SoC chip is an integrated circuit chip that can effectively reduce the development cost of electronic/information system products, shorten the development cycle, and improve the competitiveness of products. It is the most important product development method that the industry will adopt in the future.
In November 2015, the Kirin 950 SoC chip was released, using 4&TImes; Cortex A72 2.3GHz + 4&TImes; Cortex A53 1.8GHz + Mali-T880MP4+ micro-intelligent core i5, manufactured by 16nm FinFET Plus process, integrated self-developed Balong720 baseband, first integrated Research dual-core 14-bit ISP, first support LPDDR4 memory, integrated i5 coprocessor, integrated self-developed audio and video decoding chip, is a very integrated SoC mobile phone chip. Kirin 950 is also the world's first chip using A72 architecture and Mali-T880 GPU. The integrated performance of this chip is once again the first. With its performance advantages and technological advantages, it has won Qualcomm's time difference of almost half a year. . The chip is used in Huawei's Mate 8, Glory 8, Glory V8 operator customized version and standard Netcom version.
In April 2016, the Kirin 955 SoC chip was released, and the A72 architecture was upgraded from 2.3GHz to 2.5GHz. The self-developed dual-core ISP was added to help the Leica dual-camera P9 and P9Plus, the Glory V8 top version and the glory NOTE 8 mobile phone. . Leica dual lens, new trend of photography, Kirin 955 will lead the P9 series to become Huawei's first flagship machine with sales exceeding 10 million.
In May 2015, the low-end chip Kirin 650 SoC chip was released, using 4&TImes; Cortex A53 2.0GHz + 4&TImes; Cortex A53 1.8GHz + Mali-T830MP2, the world's first low-end chip manufactured by 16nm FinFET Plus process. The first Netcom baseband SoC chip integrated with CDMA, integrated with the self-developed Prime ISP, integrated self-developed audio and video decoding chip, is a highly integrated SoC mobile phone chip. This chip is equipped in the mobile version of the glory 5C, G9 youth version and dual 4G version of the mobile phone, will lead the two to continue to break tens of millions of sales.
On August 20, 2015, the shipment of Kirin chips exceeded 100 million. This is just over the past 69 days since the announcement of the break of 80 million on June 12. The average daily shipment of 690,000 in 69 days.
In 2016, the Kirin 960 will be released, which will be another chip that breaks through history, because it will greatly improve GPU performance, and it is also the first flagship chip to solve the CDMA full Netcom baseband. By then, these two black spots Remove one by one. The most powerful thing about Huawei is that it is willing to research and develop money and remove the black spots one by one. Just like the previous K3V2, P6, P7 and Mate S were ridiculed, and now these black spots no longer exist.
On September 2, 2017, at the 2017 International Consumer Electronics Show in Berlin, Germany, Huawei released the artificial intelligence chip Kirin 970. The first Huawei mobile phone Mate 10 with Kirin 970 was officially released on October 16, 2017 in Munich, Germany [3].
Ten years of grinding a sword. Huawei began to develop mobile phone chips in 2004, and the failure of the first K3 and K3V2 in 2012 in 2009. By 2014, the Haisi Kirin mobile phone chip began to enter the mainstream of the industry, here is ten years. From the Qilin 910 in 2014 to the Kirin 955 in 2016, the shipment of Hess Kirin's chips exceeded 100 million. In less than three years, it has already broken 100 million, which is three years.
Haisi Kirin chips are only used in Huawei's own products. Kirin chips have become one of Huawei's unique features. With the increasing power of Kirin chips, Haisi Kirin has become one of the competitive advantages of Huawei's mobile phones. .
A brief history of Huawei Haisi Kirin mobile phone SoC chip
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