The USB interface standard specification organization USB-IF today officially announced the first official USB 3.0 native chipset product, which is the A75, A70M, which we previously mentioned for the Llano Fusion APU high performance fusion platform. FCH.
The homogeneity of official certification also means that the two AMD APU chipsets are designed to fully comply with the various requirements of the USB 3.0 standard specification, and the compatibility is also sufficient to ensure that manufacturers and consumers can safely adopt them.
According to USB-IF, the AMD A75/A70M FCH single chipset represents a milestone in the widespread adoption of the USB 3.0 interface and represents a huge step forward for the entire industry. Its built-in USB 3.0 native support enables manufacturers to integrate seamlessly into their systems. This high-speed new interface reduces the size of the platform and reduces associated costs.
Chris Cloran, AMD’s Global Vice President and General Manager of the Client Division, also stated: “The USB 3.0 interface of the AMD FCH chipset can be used for high-definition video transmission and interconnection with the latest USB 3.0 devices, providing competitive performance while maintaining Low power consumption."
USB-FI and AMD have not announced the specific specifications of the A75/A70M FCH chipset, but according to previous reports, they are designed for mainstream desktops and notebook platforms. They all use a single-chip design, in which the USB 3.0 controller is made up of AMD and Renesas Electronics. NEC Electronics) co-developed to provide up to four USB 3.0 interfaces, as well as ten USB 2.0 and two USB 1.1.
The A75/A70M FCH is also part of the AMD Hudson family of chipset families. The other five models have no USB 3.0.
Intel's native support for the USB 3.0 interface chipset also had to wait for the Panther Point 7 series early next year, with the 22nm Ivy Bridge processor.
The homogeneity of official certification also means that the two AMD APU chipsets are designed to fully comply with the various requirements of the USB 3.0 standard specification, and the compatibility is also sufficient to ensure that manufacturers and consumers can safely adopt them.
According to USB-IF, the AMD A75/A70M FCH single chipset represents a milestone in the widespread adoption of the USB 3.0 interface and represents a huge step forward for the entire industry. Its built-in USB 3.0 native support enables manufacturers to integrate seamlessly into their systems. This high-speed new interface reduces the size of the platform and reduces associated costs.
Chris Cloran, AMD’s Global Vice President and General Manager of the Client Division, also stated: “The USB 3.0 interface of the AMD FCH chipset can be used for high-definition video transmission and interconnection with the latest USB 3.0 devices, providing competitive performance while maintaining Low power consumption."
USB-FI and AMD have not announced the specific specifications of the A75/A70M FCH chipset, but according to previous reports, they are designed for mainstream desktops and notebook platforms. They all use a single-chip design, in which the USB 3.0 controller is made up of AMD and Renesas Electronics. NEC Electronics) co-developed to provide up to four USB 3.0 interfaces, as well as ten USB 2.0 and two USB 1.1.
The A75/A70M FCH is also part of the AMD Hudson family of chipset families. The other five models have no USB 3.0.
Intel's native support for the USB 3.0 interface chipset also had to wait for the Panther Point 7 series early next year, with the 22nm Ivy Bridge processor.
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